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Flip Chip Technologies
Tue Oct 18, 2016 12:15

Flip chip is a critical technology for miniaturization,Website:, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.

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