Lease this WebApp and get rid of the ads.
Flip Chip Technologies
Tue Oct 18, 2016 12:15
125.120.86.112

Flip chip is a critical technology for miniaturization,Website:http://www.china-pcbaoem-assembly.com, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.

Click here to receive daily updates